促销中

China Multilayer Ceramic PCB Factory

( 1 customer review ) (1 条用户评价)

原价为:$39.00。当前价格为:$32.00。

Multilayer Ceramic PCB material, also known as alumina PCB material, is a type of substrate material used in the manufacturing of printed circuit boards (PCBs). Multilayer Ceramic PCB material is made from a combination of aluminum oxide, or alumina, and other compounds. Multilayer Ceramic PCBs are chosen for their high thermal conductivity and excellent electrical insulation properties.
Multilayer Ceramic PCB material is commonly used in high-power electronic devices, as Multilayer Ceramic PCB is able to withstand high temperatures and provide excellent heat dissipation. Some common applications of Multilayer Ceramic PCB material include power electronics, LED lighting, and aerospace and defense applications.
Multilayer Ceramic PCB material also has the advantages of being chemically inert, resistant to moisture, and durable. This makes it a suitable material for use in harsh environments, where reliability and longevity are critical factors.

Sale will end in
  • 00

    Day

  • 00

    Hour

  • 00

    Minute

  • 00

    Second

China Multilayer Ceramic PCB material

Multilayer Ceramic PCB material, also known as alumina PCB material, is a type of substrate material used in the manufacturing of printed circuit boards (PCBs). Multilayer Ceramic PCB material is made from a combination of aluminum oxide, or alumina, and other compounds. Multilayer Ceramic PCBs are chosen for their high thermal conductivity and excellent electrical insulation properties.
Multilayer Ceramic PCB material is commonly used in high-power electronic devices, as Multilayer Ceramic PCB is able to withstand high temperatures and provide excellent heat dissipation. Some common applications of Multilayer Ceramic PCB material include power electronics, LED lighting, and aerospace and defense applications.
Multilayer Ceramic PCB material also has the advantages of being chemically inert, resistant to moisture, and durable. This makes it a suitable material for use in harsh environments, where reliability and longevity are critical factors.

 

Multilayer Ceramic PCB Capabilities
ItemThick Film CapabilitiesDCB/DBC CapabilitiesDPC CapabilitiesAMB Capabilities
Layer Count10 Layers2 Layers2 Layers2 Layers
Max Board Dimension138*190mm138*178mm138*190mm114*114mm
Min Board Thickness0.25mm0.30mm – 0.40mm0.25mm0.25mm
Max Board Thickness2.0mm1L: 1.3mm; 2L 1.6mm2.0mm1.8mm
Conductor Thickness5um – 13um0.10mm – 0.30mm2um – 200um0.25mm – 0.80mm
Min Line Width/Line Space6/8mil (0.15/0.20mm)12/12mil (0.30/0.30mm)6/8mil (0.15/0.20mm)20/20mil (0.50/0.50mm)
Substrate TypeAl2O3, AIN, BeO, ZrO2Al2O3, AIN, ZrO2Al2O3, AIN, ZrO2, Si3N4Al2O3, AIN, Si3N4
Substrate Thickness0.25, 0.38, 0.50, 0.635, 0.80,0.25, 0.38, 0.50, 0.635, 0.76,0.25, 0.38, 0.50, 0.635, 0.80,0.25, 0.38, 0.50, 0.635, 0.76,
1.0, 1.5, 2.0mm1.0, 1.5, 2.0mm1.0, 1.5, 2.0mm1.0mm
Min Hole Diameter4mil (0.1mm)
Min Hole SpacingNPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)6mil (0.15mm)N/A3mil (0.075mm)N/A
PTH Wall Thickness4mil (10um)N/A4mil (10um)N/A
Min Solder PAD Dia10mil (0.25mm)8mil (0.20mm)6mil (0.15mm)8mil (0.20mm)
Min Soldermask Bridge12mil (0.30mm)8mil (0.20mm)6mil (0.15mm)8mil (0.20mm)
Min BGA PAD Margin12mil (0.30mm)8mil (0.20mm)5mil (0.125mm)8mil (0.20mm)
PTH/NPTH Dia TolerancePTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Hole Position Deviation± 4mil (0.1mm)
Outline ToleranceLaser: +0.20/-0.05mm
Line Width/Spac Tolerance± 5mil (0.125mm)± 5mil (0.125mm)± 1mil (0.025mm)± 5mil (0.125mm)
Surface TreatmentAgPd, AgPt, AuOSP/Ni Plating/ENIG/ENEPIG
Thermal Stress1 hour @ 350℃3 x 10 Sec @ 280 ℃15 min @ 350 ℃3 x 10 Sec @ 280 ℃

 

Multilayer Ceramic PCB Material
ItemAttribute
BrandCeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base MaterialAI2O3 / AIN / BeO / SiO2
Base Material Thickness0.20mm / 0.25mm / 0.30mm / 0.38mm / 0.50mm / 0.635mm/ 0.76mm / 0.80mm / 1.0 mm/ 1.2 mm / 1.5mm / 2.0 mm
Thermal Conductivity24w / 27w / 170w / 200w / 240W
Soldermask TypeGlass glaze , Soldermask oil (white , black , green , blue , yellow , red )
Tg Value200 / 250 / 300 / 400 / 500 / 600 / 700 / 800
Halogen FreeYes(optional)
Breakdown Voltage11 – 34 KV/
Dielectric Constant(MHZ)9月10日
Water Absorption0%
ROHSYes
Flammability94V-0
Thermal Conductivity (W/m.K, or W/m.C)Al2O3: >= 24; AIN: >=170; BeO: >=240; Si304: 16 – 22
Dielectric Strength0.635mm; 11KV/mm; 1.0mm; 17KV/mm; 2.0mm; 34KV/mm
Wrap & Twist≤ 0.75%

Multilayer Ceramic PCB Manufacturing Process

The Multilayer ceramic pcb manufacturing process is a specialized process that involves several steps. Below are the general steps involved in the Multilayer ceramic PCB manufacturing process:
Material selection: The first step in the manufacturing process of Multilayer ceramic PCB is to select the appropriate ceramic substrate material. Alumina substrates are commonly used for ceramic PCBs.
Designing the circuit: After selecting the substrate material, the next step is to design the circuit layout by using computer-aided design (CAD) software.
Printing: The designed circuit layout is printed onto the ceramic substrate using a screen printer. The printing process uses a special ink that contains conductive particles. This ink is deposited onto the substrate in the desired pattern.
Curing: After printing, the ceramic substrate is heated in a furnace to cure the printed circuit. This step allows the conductive ink to bond to the substrate and ensures that it adheres properly.
Etching: Etching is carried out on the cured ceramic substrate to remove excess conductive ink and to create the desired circuit pattern.
Drilling: Via holes are drilled into the ceramic substrate to connect the different layers of circuits.
Metallization: A layer of metal is deposited onto the substrate using a sputtering or plating process. This metal layer provides a stable surface for attaching components to the ceramic PCB.
Component attachment: The final step is to attach the electronic components to the ceramic PCB using soldering or other methods.
Once the above steps are completed, the ceramic PCB undergoes quality control testing to ensure that it meets the required specifications.

How to choose Multilayer ceramic PCB factory

Choosing the right Multilayer ceramic PCB factory is an important decision, here are some factors to consider when choosing Multilayer ceramic PCB factory:

  • Ceramic PCB Fab Manufacturing Capabilities: Find a factory with the manufacturing capabilities to produce the type of ceramic PCB you need. This includes the ability to produce multilayer PCBs, high frequency PCBs and high power PCBs.
  • Ceramic PCB Factory Quality: Choose a factory known for producing high quality and reliable ceramic PCBs.
  • Material selection: Make sure the factory offers a range of ceramic materials to choose from, such as Rogers Corporation’s RO4000, RO3000 and RO4400 series. This allows you to choose the material that best suits your application.
  • Experience and Expertise: Look for factories with experience and expertise in producing ceramic PCBs. They should have a team of engineers and technicians who are proficient in ceramic materials and PCB manufacturing processes.
  • Customer Service and After-Sales Support: Choose a factory that offers exceptional customer service and support, technical assistance, design reviews and after-sales support.
  • Cost: Consider the cost of the ceramic PCB. Look for a factory that offers competitive pricing without compromising quality and reliability.

Overall, choosing the right ceramic PCB factory requires careful consideration of several factors. By taking the time to research and evaluate different plants, you can find a partner who can meet your needs and help you achieve your goals.

 

Multilayer Ceramic PCB characteristics

Multilayer ceramic PCB, also known as multilayer ceramic substrate, the characteristics of multilayer ceramic PCB:
Multilayer ceramic PCB enables high integration in a compact form factor;
Multilayer ceramic PCB has the characteristics of low electrical loss, high insulation resistance and low signal distortion; multilayer ceramic PCB has good thermal conductivity;
Multilayer ceramic PCB provides excellent reliability and long-term stability;
Multilayer ceramic PCBs have low resistance and can handle high voltages, making them suitable for applications requiring high-power operation or high-voltage circuits;
Multilayer ceramic PCBs are surface mount technology (SMT) compatible, allowing efficient assembly of components using automated pick and place machines;
The ceramic materials used in multilayer ceramic PCBs are environmentally friendly and comply with environmental regulations such as the RoHS directive;
Multilayer ceramic PCBs are more expensive than traditional PCBs, and multilayer ceramic PCBs are often used in high-reliability applications such as aerospace, telecommunications, automotive electronics, and medical equipment.

其他信息

重量58 公斤
尺寸45 × 54 × 33 厘米

China Multilayer Ceramic PCB Factory 有 1 个评价

  1. Avatar for 450643518@qq.com

    Alice

    Overall, I highly recommend Ruxian Technology’s multilayer ceramic PCB to everyone. Ruxian Technology’s multilayer ceramic PCB products are really outstanding. I am very happy with my purchase and will definitely be a repeat customer in the future.

添加评价

您的电子邮箱地址不会被公开。 必填项已用 * 标注

China Multilayer Ceramic PCB Factory 有 1 个评价

  1. Avatar for 450643518@qq.com

    Alice

    Overall, I highly recommend Ruxian Technology’s multilayer ceramic PCB to everyone. Ruxian Technology’s multilayer ceramic PCB products are really outstanding. I am very happy with my purchase and will definitely be a repeat customer in the future.

添加评价

您的电子邮箱地址不会被公开。 必填项已用 * 标注